Lanner Electronics and MOV.AI are collaborating to provide Autonomous Mobile Robots (AMR) manufacturers with an integrated computing and software platform for optimized performance and faster AMR development and deployment.
LAPP North America is pleased to announce it will be an exhibitor at ATX West, April 12 to 14, Booth 4454 at the Anaheim Convention Center in Anaheim, California.
Mouser Electronics, Inc., the New Product Introduction (NPI) leader empowering innovation, announces a new resource site dedicated to its engaging podcast episodes. The site features all episodes from the Empowering Innovation Together podcast series, The Tech Between Us, and will serve as a central hub for all future podcast episodes produced by Mouser.
Blickfeld, a Munich-based manufacturer of LiDAR hardware and software solutions, introduces the "Cube 1 Outdoor" LiDAR sensor designed for outdoor use. The new sensor is based on the "Cube 1" model, which has already been successfully used in numerous projects, including volume measurement and people counting, as well as in security applications.
MikroElektronika (MIKROE), the embedded solutions company that dramatically cuts development time by providing innovative hardware and software products based on proven standards, is unveiling a portfolio of over 100 smart display development boards that enable multimedia applications to be built simply and quickly.
Edge computing is key to optimising data-driven activities, supporting the implementation of innovative digital technologies and ultimately the creation of the Connected Industries of the future. It allows data processing to take place close to the source, turning key data into actionable information.
Innovative solutions for intelligent applications in the areas of Industrial Internet of Things (IIoT) and the Internet of Everything (IoE) are the focus of Rutronik Elektronische Bauelemente GmbH's exhibition stand at Sensor+Test 2022 (May 10-12, 2022).
3D Systems has announced the SLA 750 stereolithography additive manufacturing (AM) solution. The solution is optimized for cost-effective SLA batch part production at up to twice the speed and triple the throughput of other available stereolithography solutions.