Micro Epsilon deploys the surfaceCONTROL 3D 3560 sensor to seamlessly integrate the processing and evaluation of geometric data into industrial factory automation systems.
Global technology, software and engineering leader Emerson will present its latest fit-for-purpose packaging solutions from AVENTICS™ and Afag brands at PACK EXPO 2026 from October 18-21 in Chicago.
Festo showcases modular automation solutions, decentralized valve terminals, and integrated explosion-protection systems for hydrogen production skids at Hydrogen Technology World Expo 2026.