24 {{ "2022-10-24T00:00:00+00:00" | date "MMM" }} '22

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Beckhoff News

Software-controlled for efficient and resource-saving plastics processing

PC-based control, the PC- and EtherCAT-based control and drive technology from Beckhoff, offers great potential for making machines and systems for the plastics processing industry work more sustainably. The software is based on the TwinCAT 3 Plastic Framework, the TwinCAT Analytics data analysis solution, and TwinCAT OPC UA for communication according to the Euromap standard.

Read more…

24 {{ "2022-10-24T00:00:00+00:00" | date "MMM" }} '22

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BYSTRONIC News

BYSTRONIC LAUNCHES A NEW MACHINE-LEVEL PROTECTION SERVICE AGAINST CYBER-EVENTS AND HUMAN ERROR CO-DEVELOPED WITH NANOLOCK SECURITY

The new machine-level service ensures laser and bending systems are even better protected against cyber-events. It will be available as an option with in bystronic’s well-established service offerings and delivers on bystronic’s strategy to further expand its service business.

Read more…

22 {{ "2022-10-22T00:00:00+00:00" | date "MMM" }} '22

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MICRO EPSILON News

MICRO-EPSILON: MEASURE RAILWAY FISHPLATES AUTOMATICALLY

Mills CNC uses Micro-Epsilon laser sensors for the automatic inspection of large, hot-rolled railway fishplates made of steel. These fishplates join two rails together and must be as straight and flat as possible.

Read more…

21 {{ "2022-10-21T00:00:00+00:00" | date "MMM" }} '22

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Hardware Pioneers News

Hardware Pioneers Max 2022: The show where Electronics, IoT Connectivity and Embedded Systems converge October 25th, London

Discover the latest technologies on the market from world-leading manufacturers and service providers in electronics and IoT.

Read more…

21 {{ "2022-10-21T00:00:00+00:00" | date "MMM" }} '22

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Infineon News

Infineon delivers next-generation CIRRENT SaaS offering to optimize product development with intelligent data

At OktoberTech 2022, Infineon Technologies AG is bringing digitalization to the edge-from-the-cloud.

Read more…

21 {{ "2022-10-21T00:00:00+00:00" | date "MMM" }} '22

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Nexcom News

Nexcom: Raise Performance for Industrial Edge AI Applications with NISE 70-T02/03

NISE 70-T02/T03 features the 11th Gen Intel^® Core i7/i5 processors, bringing ultimate performance to embedded computing. It offers greater performance and improved efficiency over predecessors, delivering next-level processing speeds and capabilities.

Read more…

21 {{ "2022-10-21T00:00:00+00:00" | date "MMM" }} '22

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Visual components News

VISUAL COMPONENTS: HYPERAUTOMATION FOR MANUFACTURERS AND THE ROLE OF SIMULATION

The road to hyper-automation in manufacturing requires strategic planning and decisions however, it is also important to realize that manufacturing simulation is critical to the successful implementation of hyper-automation.

Read more…

20 {{ "2022-10-20T00:00:00+00:00" | date "MMM" }} '22

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Leica Geosystems News

Hexagon and LocLab announce strategic partnership to accelerate the adoption of Smart Digital Realities in transportation, construction and urban planning

Hexagon's Geosystems division and LocLab, a leader in 3D digital twin content creation, announced today a strategic partnership to jointly empower industries with Smart Digital Realities in their design, construction and operations processes.

Read more…

20 {{ "2022-10-20T00:00:00+00:00" | date "MMM" }} '22

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VIA Tech News

VIA to Debut VIA SOM-9X12 Module Powered by MediaTek Genio 1200 SoC at Japan IT Week Autumn 2022

VIA Technologies, Inc, today announced that it will debut the VIA SOM-9X12 Module featuring the MediaTek Genio 1200 SoC at Japan IT Week Autumn 2022, which takes place at the Makuhari Messe in Tokyo from October 26 to 28.

Read more…

20 {{ "2022-10-20T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-10-20T00:00:00+00:00" | date "longDate" }}

Allied Electronics & Automation News

Allied Electronics & Automation Offers Extensive Array of Motion Control Products for Automation Applications

Solutions from seals, bearings, and belts to AC motors and hydraulic pumps, valves, and power units are available from a wide range of industry-leading suppliers.

Read more…

Case studies

Decentralized Servo Motion in Industrial Robotics

Software-controlled for efficient and resource-saving plastics processing

BYSTRONIC LAUNCHES A NEW MACHINE-LEVEL PROTECTION SERVICE AGAINST CYBER-EVENTS AND HUMAN ERROR CO-DEVELOPED WITH NANOLOCK SECURITY

The new machine-level service ensures laser and bending systems are even better protected against cyber-events. It will be available as an option with in bystronic’s well-established service offerings and delivers on bystronic’s strategy to further expand its service business.

MICRO-EPSILON: MEASURE RAILWAY FISHPLATES AUTOMATICALLY

Mills CNC uses Micro-Epsilon laser sensors for the automatic inspection of large, hot-rolled railway fishplates made of steel. These fishplates join two rails together and must be as straight and flat as possible.

Hardware Pioneers Max 2022: The show where Electronics, IoT Connectivity and Embedded Systems converge October 25th, London

Discover the latest technologies on the market from world-leading manufacturers and service providers in electronics and IoT.

Infineon delivers next-generation CIRRENT SaaS offering to optimize product development with intelligent data

At OktoberTech 2022, Infineon Technologies AG is bringing digitalization to the edge-from-the-cloud.

Nexcom: Raise Performance for Industrial Edge AI Applications with NISE 70-T02/03

NISE 70-T02/T03 features the 11th Gen Intel^® Core i7/i5 processors, bringing ultimate performance to embedded computing. It offers greater performance and improved efficiency over predecessors, delivering next-level processing speeds and capabilities.

VISUAL COMPONENTS: HYPERAUTOMATION FOR MANUFACTURERS AND THE ROLE OF SIMULATION

The road to hyper-automation in manufacturing requires strategic planning and decisions however, it is also important to realize that manufacturing simulation is critical to the successful implementation of hyper-automation.

Hexagon and LocLab announce strategic partnership to accelerate the adoption of Smart Digital Realities in transportation, construction and urban planning

Hexagon's Geosystems division and LocLab, a leader in 3D digital twin content creation, announced today a strategic partnership to jointly empower industries with Smart Digital Realities in their design, construction and operations processes.

VIA to Debut VIA SOM-9X12 Module Powered by MediaTek Genio 1200 SoC at Japan IT Week Autumn 2022

VIA Technologies, Inc, today announced that it will debut the VIA SOM-9X12 Module featuring the MediaTek Genio 1200 SoC at Japan IT Week Autumn 2022, which takes place at the Makuhari Messe in Tokyo from October 26 to 28.

Allied Electronics & Automation Offers Extensive Array of Motion Control Products for Automation Applications

Solutions from seals, bearings, and belts to AC motors and hydraulic pumps, valves, and power units are available from a wide range of industry-leading suppliers.

International

Case studies

The new machine-level service ensures laser and bending systems are even better protected against cyber-events. It will be available as an option with in bystronic’s well-established service offerings and delivers on bystronic’s strategy to further expand its service business.

Mills CNC uses Micro-Epsilon laser sensors for the automatic inspection of large, hot-rolled railway fishplates made of steel. These fishplates join two rails together and must be as straight and flat as possible.

Discover the latest technologies on the market from world-leading manufacturers and service providers in electronics and IoT.

At OktoberTech 2022, Infineon Technologies AG is bringing digitalization to the edge-from-the-cloud.

NISE 70-T02/T03 features the 11th Gen Intel® Core i7/i5 processors, bringing ultimate performance to embedded computing. It offers greater performance and improved efficiency over predecessors, delivering next-level processing speeds and capabilities.

The road to hyper-automation in manufacturing requires strategic planning and decisions however, it is also important to realize that manufacturing simulation is critical to the successful implementation of hyper-automation.

Hexagon's Geosystems division and LocLab, a leader in 3D digital twin content creation, announced today a strategic partnership to jointly empower industries with Smart Digital Realities in their design, construction and operations processes.

VIA Technologies, Inc, today announced that it will debut the VIA SOM-9X12 Module featuring the MediaTek Genio 1200 SoC at Japan IT Week Autumn 2022, which takes place at the Makuhari Messe in Tokyo from October 26 to 28.

Solutions from seals, bearings, and belts to AC motors and hydraulic pumps, valves, and power units are available from a wide range of industry-leading suppliers.

International

NISE 70-T02/T03 features the 11th Gen Intel^® Core i7/i5 processors, bringing ultimate performance to embedded computing. It offers greater performance and improved efficiency over predecessors, delivering next-level processing speeds and capabilities.